In the meantime, the reliability of forward compatibility solder joint was simply introduced, the reliability may.
在电子产品向无铅化过渡时期,存在前向兼容和后向兼容混合焊点的可靠性问题,对相关的理论和实验研究进行了综述。
Reliability analysis of forwards compatible solder joint;
向前兼容焊点的可靠性分析
